Low temperatur ICB wafer bonder (ISIT03.1) - PR879696-2390-P
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Negotiated without prior call for competition
- Ref. number
- ff93145e-15ed-43ca-af0c-1c78007c6685
- CPV
- 42990000
Low temperatur ICB wafer bonder