200 mm Wafer Prober incl. Temperature Testing - PR874550
Deadline:06 Mar 2025, 12:00 CET
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (tender)
- Procedure
- Open
- Ref. number
- 43cc0442-1109-4979-83c5-ab28f760ce40
- CPV
- 38552000
1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 30…