Chip to Wafer Bonder
Tender information
DE_BKMSFrankfurt (Oder), Germany
- Type
- goods (award)
- Procedure
- Open
- Ref. number
- 800ba8c9-e255-41bf-ae94-169d4a1f99a8
- Estimated value
- 891,310 EUR
- CPV
- 38000000
Dyson V15s Detect SubmarineTM Nass- und Trockensauger