Optical profilometer with the ability to measure the Warpage (bending) of 300 mm wafer
Deadline:07 Nov 2025, 12:00 CET
Tender information
DE_BKMSGermany
- Type
- tender
- Procedure
- Public announcement
- Ref. number
- 24537124
- CPV
- 38000000-5
Optical profilometer with the ability to measure the Warpage (bending) of 300 mm wafer