Silicon Austria Labs – Chips JU: Wafer bumper
Tender information
AT_KDQ_XMLAustria
- Type
- Lieferauftrag
- Procedure
- Verhandlungsverfahren mit vorheriger Bekanntmachung
- Ref. number
- a2c49245-23b2-46e1-acc7-c5a78913a090:652f70c2-e525-4795-807d-3815a2c4acfe
- Estimated value
- 1,260,320 EUR
- CPV
- 38000000
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool a…