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Die Bonding System

Deadline:16 Jul 2026, 12:00 BST

Tender information

UK CF

Bristol, United Kingdom

Type
goods (tender)
Procedure
Open procedure (below threshold)
Ref. number
21933349-7465-49c1-a0c0-59f1caeb33ed-904105
Estimated value
215,000 GBP
CPV
38000000

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production

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