Los 1: High Accuracy Flip Chip Bonder low force
Deadline:12 May 2025, 00:00 CEST
Tender information
TED EUMünchen, Germany
- Type
- 16
- Procedure
- open
- Ref. number
- 231671-2025
- CPV
- 31712100
High Precision bonder for wafer and chiplet level assembly (IZM-01)