Silicon deep reactive ion etcher (Si DRIE)
Deadline:26 Sept 2025
Tender information
TED EUKgs. Lyngby, Denmark
- Type
- 16
- Procedure
- open
- Ref. number
- 562633-2025
- CPV
- 38000000
DTU Nanolab requires a silicon deep reactive ion etcher (Si DRIE) to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q4 2026. The Instrument will be installed in the DTU …