- Type
- 29
- Procedure
- open
- Ref. number
- 102590-2026
- Estimated value
- 325,000 EUR
- CPV
- 42900000
The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafer…
s of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroo
m equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents.