Single wafer plasma asher tool

The procurement includes a process chamber for Polymer Removal and PR ash. The single-wafer plasma asher tool is for silicon semiconductor front-end, the tool must be compatible with industry-standard cleanroom requirements, including automated wafer handling, welded gas lines with VCR-gasket constr

uction, particle filters, etc., and CE-compliant, with Emergency shutdown, capable processing of 200 mm including the following processes: Polymer removal PR ash (bulk strip, HDIS, Descums) The Single wafer asher tool will be used in silico