Kgs. Lyngby, Denmark
To ensure the continuation of small and medium sized companies chip production and development in Danmark DTU Nanolab want to purchase a new (non-refurbished) DUV stepper using a 248 nm wavelength laser as illumination s…
ource (KrF laser unit from CYMER). It must furthermore be possible to handle several different wafer types and sizes: Wafer materials: Silicon, LNOI, Borofloat, quartz, III-V Wafer sizes in diameter: 100mm, 150mm and 200mm, furthermore it must be equipped with a multi wafer handling kit such that ea
sy switching between at least 150mm and 200mm wafers is possible without longer downtime for reconfiguration of the equipment. Wafer thickness to be handled are from 350µm up to 1000µm and they can come with a bow up to at least +/- 200um f