LA2974C- UCC- RFT for the Supply, Delivery and Installation of a Wafer Surface Planarisation System

ing processing where complex layers and 3D structures have been built up. The system will be required to reduce surface height variation and surface roughness over a large area, i.e. a full wafer. The system will be required to process as wide a range of materials as possible, particularly metals an

d polymers, and must be suited for use with wafer sizes of up to 200mm, 8 inches, in diameter.