Thin Film Cluster Deposition System for Sputtering of Metals and Dielectrics
Deadline:20 Jan 2025, 00:00 CET
Tender information
TED EUZürich, Switzerland
- Type
- 16
- Procedure
- open
- Ref. number
- 737767-2024
- CPV
- 38000000
Thin-film cluster coating system for sputtering metals and dielectrics Cluster system with an airlock and 4 process chambers (PCs) for DC and RF sputtering of dielectrics and metals on semiconductors and other substrates…