200 mm Wafer Prober incl. Temperature Testing - PR874550

Deadline:06 Mar 2025, 00:00 CET

Tender information

TED EU

München, Germany

Type: 16
Procedure: open
Ref. number: 98618-2025
CPV: 38552000

1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 30…

0 mm wafers. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetical sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to

be made off non-magnetic metarials to prevent distortion while characterizing magnetic field sensors. Options: 2.1 Installing Conditions AC Voltage (prefered specifications) 230 V 50 Hz, 16 A fuse 3.3 Wafer probing Optional: Wafer thickness

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