Fully Automatic Wafer-to Wafer Bonder - PR408678-3460-W
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Ref. number
- b16440c9-baa9-41a5-a775-dc06638b63df
- CPV
- 42990000
Fully Automatic Wafer-to Wafer Bonder