High Precision bonder for wafer and chiplet level assembly (IZM-01 - PR915599-2590-P
Deadline:12 May 2025, 08:30 CEST
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (tender)
- Procedure
- Open
- Ref. number
- ef0b4964-ba8b-4abe-973c-62a3e25ff23a
- CPV
- 31712100
High Precision bonder for wafer and chiplet level assembly (IZM-01)